Department X-Ray Microscopy
Materials science applications
- Electromigration in dual damascence Cu via/interconnect structures in intergrated circuits
- Stress-induced migration in advanced IC structures
- NEXAFS investigation on nanoparticles like carbon nanotubes or sodium titanate nanoribbons within the COST action MP0901 "NanoTP"
- Magnetic materials (will start with TXM operation at UE46)