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Department X-Ray Microscopy

Materials science applications

  • Electromigration in dual damascence Cu via/interconnect structures in intergrated circuits
  • Stress-induced migration in advanced IC structures
  • NEXAFS investigation on nanoparticles like carbon nanotubes or sodium titanate nanoribbons within the COST action MP0901 "NanoTP" 
  • Magnetic materials (will start with TXM operation at UE46)
Symbol image Materials science applications - enlarged view