Huck, M.; Bahrdt, J.; Huck, H.; Meseck, A.; Ries, M.: Transverse Broad-band Impedance Studies of the New In-vacuum Cryogenic Undulator at Bessy II Storage Ring. In: Daniel Tavares ... [Ed.] : IBIC2020 : Proceedings of the 9th International Beam Instrumentation Conference (remote) : 14-18 September 2020, Brazil Geneve: JACoW, 2020. - ISBN 978-3-95450-222-6, p. THPP26/1-5
http://accelconf.web.cern.ch/ibic2020/papers/thpp26.pdf
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