EMIL

Thermoelectric Sputtertool

A PVD (sputtering) deposition system, which has been developed specifically for the deposition of ultra-thin layers is integrated in the setup of the SISSY-UHV system. It is intended mainly for the preparation of layers for the spectroscopic analysis of surfaces and interfaces. The base pressure of the sputter chamber is 1 x 10-8 mbar, the working pressure range is adjustable from 3 x 10^-3 to 3 x 10^-2 mbar. The tool is equipped with 8 sources and up to four of them can be operated simultaneously in DC mode. In RF mode, the co-deposition from 2 different targets is possible. In addition to the Ar working gas, further gases such as oxygen and nitrogen can be used for reactive sputter processes. The diameter of each target is 2 inches, but due to the large target-to-substrate distance and the rotation of the substrates homogeneous depositions on substrates with a diameter of up to 6 inches are feasible. Substrate heating up to a temperature of approx. 800°C can be applied by heater integrated in a dedicated sample holder.